ZHCSO02B July 2007 – July 2021 TRSF3221E
PRODUCTION DATA
- 1 特性
- 2 应用
- 3 说明
- 4 Revision History
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 ESD Ratings, IEC Specifications
- 6.4 Recommended Operating Conditions
- 6.5 Thermal Resistance Characteristics
- 6.6 Electrical Characteristics
- 6.7 Electrical Characteristics, Driver
- 6.8 Switching Characteristics, Driver
- 6.9 Electrical Characteristics, Receiver
- 6.10 Switching Characteristics, Receiver
- 6.11 Electrical Characteristics, Auto-Powerdown
- 6.12 Switching Characteristics, Auto-Powerdown
- 6.13 Typical Characteristics
- 7 Parameter Measurement Information
- 8 Detailed Description
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
- RGT|16
订购信息
6.13 Typical Characteristics
Figure 6-1 Driver
Pulse Skew vs Load Capacitance and Supply Voltage at TA = 25 °C
(RGT Package)
Figure 6-3 . Receiver Path
High-to-Low Propagation Delay vs TA and Supply Voltage (RGT Package)
Figure 6-2 Receiver Path Low-to-High
Propagation Delay vs TA and Supply Voltage (RGT Package)
Figure 6-4 Receiver Pulse Skew
(|tpLH - tpHL|) vs TA and Supply
Voltage (RGT Package)