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ZHCSJ92E October 2009 – September 2022 TS12A12511

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		TS12A12511			UNIT
		DCN	DGK	DRJ
		8 PINS
R_θJA	Junction-to-ambient thermal resistance	218.4	184.5	47.8	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	89.9	71.0	48.6
R_θJB	Junction-to-board thermal resistance	144.4	104.5	24.2
ψ_JT	Junction-to-top characterization parameter	7.8	11.3	1.2
ψ_JB	Junction-to-board characterization parameter	141.7	103.3	24.4
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	9.0

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.