ZHCSD70B
November 2014 – February 2015
TS3A227E
PRODUCTION DATA.
1
特性
2
应用范围
3
说明
4
简化电路原理图
5
修订历史记录
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
I2C Interface Timing Characteristics
7.7
Timing Diagrams
7.7.1
Removal
7.8
Typical Characteristics
8
Parameter Measurement Information
9
Detailed Description
9.1
Overview
9.2
Functional Block Diagram
9.3
Feature Description
9.3.1
Accessory Configuration Detection
9.3.2
Optional Manual I2C Control
9.3.3
Adjustable De-bounce Timings
9.3.4
Key Press Detection
9.3.5
Click Pop Noise Reduction
9.3.6
Power off Noise Removal
9.3.7
Sleep Mode
9.3.8
Codec Sense Line
9.3.9
FM Support
9.4
Device Functional Modes
9.4.1
Sleep Mode
9.4.2
Manual Switch Control
9.4.3
Manual Switch Control Use Cases
9.4.4
FM Support Mode
9.5
Register Maps
9.6
Register Field Descriptions
9.6.1
Device ID Register Field Descriptions (Address 00h)
9.6.2
Interrupt Register Field Descriptions (Address 01h)
9.6.3
Key Press Interrupt Register Field Descriptions (Address 02h)
9.6.4
Interrupt Disable Register Field Descriptions (Address 03h)
9.6.5
Device Settings Field Descriptions (Address 04h)
9.6.6
Key Press Settings 1 Field Descriptions (Address 05h)
9.6.7
Key Press Settings 2 Field Descriptions (Address 06h)
9.6.8
Switch Control 1 Field Descriptions (Address 07h)
9.6.9
Switch Control 2 Field Descriptions (Address 08h)
9.6.10
Switch Status 1 Field Descriptions (Address 09h)
9.6.11
Switch Status 2 Field Descriptions (Address 0Ah)
9.6.12
Detection Results Field Descriptions (Address 0Bh)
9.6.13
ADC Output Field Descriptions (Address 0Ch)
9.6.14
Threshold 1 Field Descriptions (Address 0Dh)
9.6.15
Threshold 2 Field Descriptions (Address 0Eh)
9.6.16
Threshold 3 Field Descriptions (Address 0Fh)
10
Application and Implementation
10.1
Application Information
10.2
Typical Application
10.2.1
Design Requirements
10.2.1.1
Standard I2C Interface Details
10.2.1.2
Write Operations
10.2.1.3
Read Operations
10.2.2
Detailed Design Procedure
10.2.2.1
Accessory Insertion
10.2.2.2
Audio Jack Selection
10.2.2.3
Switch Status
10.2.2.3.1
Switch Status Diagrams
10.2.2.4
Key Press Detection
10.2.2.4.1
Key Press Thresholds
10.2.2.4.2
System Requirements
10.2.2.4.3
Key Press Grey Zones
10.2.2.4.4
Behavior
10.2.2.4.5
Single Key Press Timing
10.2.2.4.6
Multiple Key Press Timing
10.2.2.4.7
Raw Data Key Press Detection
10.2.3
Application Curves
11
Power Supply Recommendations
12
Layout
12.1
Layout Guidelines
12.2
Layout Example (QFN)
12.3
Layout Example (DSBGA)
13
器件和文档支持
13.1
商标
13.2
静电放电警告
13.3
术语表
14
机械封装和可订购信息
封装选项
机械数据 (封装 | 引脚)
YFF|16
MXBG096W
RVA|16
MPQF232B
散热焊盘机械数据 (封装 | 引脚)
RVA|16
QFND178A
订购信息
zhcsd70b_oa
zhcsd70b_pm
8 Parameter Measurement Information
Figure 5. RING2/SLEEVE GNDFET On Resistance Measurement
Figure 6. RING2/SLEEVE DFET On Resistance Measurement
Figure 7. S1/S2 On Resistance Measurement
Figure 8. S3PS, S3PR, S3GS, S3GR On Resistance Measurement
Figure 9. Switch Off Leakage Current
Figure 10. Switch On Leakage Current
Figure 11. Power Supply Rejection Ratio (PSRR)
Figure 12. Switch Off Isolation
Figure 13. Channel Separation
Figure 14. Total Harmonic Distortion (THD) and SNR
Figure 15. S3 t
OFF
/t
O
N
Figure 16. S1, S2, GNDFET and DFET t
ON
/t
OFF
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