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ZHCSJI4F July 2006 – March 2015 TS3A4751

PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		TS3A4751			UNIT
		PW	RGY	RUC
		14 PINS
R_θJA	Junction-to-ambient thermal resistance	132.3	68.5	196.4	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	60.6	83.1	73.9
R_θJB	Junction-to-board thermal resistance	74.2	44.6	130.7
ψ_JT	Junction-to-top characterization parameter	11.2	7.8	2.1
ψ_JB	Junction-to-board characterization parameter	73.6	44.7	130.6
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	24.6	N/A

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.