ZHCSIY9 October 2018 TS3A5017-Q1
PRODUCTION DATA.
THERMAL METRIC(1) | TS3A5017-Q1 | UNIT | |
---|---|---|---|
RGY (VQFN) | |||
16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 47.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 58.5 | °C/W |
RθJB | Junction-to-board thermal resistance | 24.0 | °C/W |
ψJT | Junction-to-top characterization parameter | 1.8 | °C/W |
ψJB | Junction-to-board characterization parameter | 24.0 | °C/W |