To ensure reliability of the device, the following commonly used printed-circuit board layout guidelines are recommended:

• Decoupling capacitors should be used between power supply pin and ground pin to ensure low impedance to reduce noise To achieve a low impedance over a wide frequency range use capacitors with a high self-resonance frequency.
• ESD and EMI protection devices (if used) should be placed as close as possible to the connector.
• Short trace lengths should be used to avoid excessive loading.
• To minimize the effects of crosstalk on adjacent traces, keep the traces at least two times the trace width apart.
• Separate high-speed signals from low-speed signals and digital from analog signals
• Avoid right-angle bends in a trace and try to route them at least with two 45° corners.
• The high-speed differential signal traces should be routed parallel to each other as much as possible. The traces are recommended to be symmetrical.
• A solid ground plane should be placed next to the high-speed signal layer. This also provides an excellent low-inductance path for the return current flow.