Changes from Revision A (February 2015) to Revision B (July 2024)
- 更新了整个文档中的表格、图和交叉参考的编号格式Go
- 更新了特性 部分中的 ESD 性能测试条件Go
- Changed CDM test conditions in the
ESD Ratings table from: per JEDEC specification
JESD22-C101 to: per ANSI/ESDA/JEDEC
JS-002Go
- Added footnote to the VI/O parameter in the
Recommended Operating Conditions tableGo
- Changed RSE (UQFN)
junction-to-ambient thermal resistance value from:
179.7°C/W to: 204.8°C/WGo
- Changed RSE (UQFN)
junction-to-case (top) thermal resistance value
from: 107.9°C/W to: 118.1°C/WGo
- Changed RSE (UQFN)
junction-to-board thermal resistance value from:
100.7°C/W to: 121.5°C/WGo
- Changed RSE (UQFN) junction-to-top
characterization parameter value from: 7.1°C/W to:
13.9°C/WGo
- Changed RSE (UQFN)
junction-to-board characterization parameter value
from: 100.0°C/W to: 121.2°C/WGo
- Changed the VIK value in the Electrical
Characteristics table from: –1.8V maximum to: –1.8V
minimumGo
- Changed the Typical Characteristics sectionGo