ZHCSBM1D September   2013  – August 2024 TS3USB3031

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Dynamic Characteristics
    7. 5.7 Typical Characteristics
  7.   Parameter Measurement Information
  8. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 IOFF Protection
      2. 6.3.2 1.8-V Compatible Logic
      3. 6.3.3 Overvoltage Tolerant (OVT)
    4. 6.4 Device Functional Modes
  9. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
        1. 7.2.3.1 MHL Eye Pattern
        2. 7.2.3.2 USB EYE Pattern
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  10. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  11. 9 Revision History
  12. 10Mechanical, Packaging, and Orderable Information

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7.2.2 Detailed Design Procedure

The TS3USB3031 can be properly operated without any external components. However, TI recommends that unused signal I/O pins must be connected to ground through a 50-Ω resistor to prevent signal reflections back into the device.
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