ZHCSBM1D September 2013 – August 2024 TS3USB3031
PRODUCTION DATA
THERMAL METRIC(1) | TS3USB3031 | UNIT | |
---|---|---|---|
RMG (VQFN) | |||
12 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 160.8 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 95.5 | °C/W |
RθJB | Junction-to-board thermal resistance | 91.2 | °C/W |
ψJT | Junction-to-top characterization parameter | 7.4 | °C/W |
ψJB | Junction-to-board characterization parameter | 91.2 | °C/W |