ZHCSX92G December   2008  – October 2024 TS3USB30E

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Dynamic Electrical Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

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订购信息

Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)  (1).
MIN MAX UNIT
VCC Supply voltage 3 4.3 V
VIH High-level control input voltage VCC = 3V to 3.6V 1.3 VCC V
VCC = 4.3V 1.7 VCC
VIL Low-level control input voltage VCC = 3V to 3.6V 0 0.5 V
VCC = 4.3V 0 0.7
VI/O Data input/output voltage 0 VCC V
TA Operating free-air temperature –40 85 °C
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to Implications of Slow or Floating CMOS Inputs.