ZHCSIM3F January 2005 – August 2018 TS5A2066
PRODUCTION DATA.
请参考 PDF 数据表获取器件具体的封装图。
| THERMAL METRIC(1) | TS5A2066 | UNIT | |||
|---|---|---|---|---|---|
| DCT (SSOP) | DCU (VSSOP) | YZP (DSBGA) | |||
| 8 PINS | 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 214.1 | 212.8 | 99.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 106.8 | 93.6 | 1.0 | °C/W |
| RθJB | Junction-to-board thermal resistance | 127.8 | 133.6 | 29.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 30.2 | 30.4 | 0.5 | °C/W |
| ψJB | Junction-to-board characterization parameter | 125.5 | 133.1 | 29.8 | °C/W |