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ZHCSJ90F MAY 2004 – January 2019 TS5A23157

PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		TS5A23157		UNIT
		DGS (VSSOP)	RSE (UQFN)
		10 PINS	10 PINS
R_θJA	Junction-to-ambient thermal resistance	210.5	215.4	°C/W
R_θJCtop	Junction-to-case (top) thermal resistance	99.1	140.2	°C/W
R_θJB	Junction-to-board thermal resistance	132.4	137.9	°C/W
ψ_JT	Junction-to-top characterization parameter	29.1	13.7	°C/W
ψ_JB	Junction-to-board characterization parameter	130.5	137.6	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.