ZHCSIN1B OCTOBER   2004  – August 2018 TS5A3357

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      逻辑图
  4. 修订历史记录
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics for 5-V Supply
    6. 7.6 Electrical Characteristics for 3.3-V Supply
    7. 7.7 Electrical Characteristics for 2.5-V Supply
    8. 7.8 Electrical Characteristics for 1.8-V Supply
    9. 7.9 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 器件支持
    2. 13.2 文档支持
    3. 13.3 接收文档更新通知
    4. 13.4 社区资源
    5. 13.5 商标
    6. 13.6 静电放电警告
    7. 13.7 术语表
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Thermal Information

THERMAL METRIC(1) TS5A3357 UNIT
DCU (VSSOP)
8 PINS
RθJA Junction-to-ambient thermal resistance 206.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 78.7 °C/W
RθJB Junction-to-board thermal resistance 85.3 °C/W
ψJT Junction-to-top characterization parameter 7.3 °C/W
ψJB Junction-to-board characterization parameter 84.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.