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ZHCSHG2E January 2018 – April 2019 TS5MP646

PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		TS5MP646	UNIT
		YFP
		36
R_θJA	Junction-to-ambient thermal resistance	57.6	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	0.3	°C/W
R_θJB	Junction-to-board thermal resistance	12.6	°C/W
Ψ_JT	Junction-to-top characterization parameter	0.2	°C/W
Ψ_JB	Junction-to-board characterization parameter	12.7	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.