ZHCSHG2E January   2018  – April 2019 TS5MP646

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      D-PHY 简化原理图
      2.      C-PHY 简化原理图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Powered-Off Protection
      2. 8.3.2 1.8-V Logic Compatible Inputs
      3. 8.3.3 Low Power Disable Mode
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pin Functions
      2. 8.4.2 Low Power Disable Mode
      3. 8.4.3 Switch Enabled Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
        1. 9.2.3.1 MIPI D-PHY Application
        2. 9.2.3.2 MIPI C-PHY Application
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from D Revision (January 2019) to E Revision

  • Added min differential bandwidth specification 2.7 GHzGo
  • Changed typ differential bandwith specification to 4.1 GHzGo

Changes from C Revision (August 2018) to D Revision

  • 添加了 D-PHY 以及 C-PHY 简化原理图Go
  • Added the Typical D-PHY and C-PHY Application circuitsGo
  • Added Eye diagrams to the Application Curves sectionGo
  • Added the MIPI D-PHY Application sectionGo
  • Added the MIPI C-PHY Application sectionGo

Changes from B Revision (July 2018) to C Revision

  • 已更改 应用 列表Go

Changes from A Revision (March 2018) to B Revision

    Changes from * Revision (January 2018) to A Revision

    • 将器件信息 表中的“封装尺寸（标称值）”从 2.459 x 2.459 更改成了 2.42 x 2.42Go
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