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ZHCSGS1A September 2017 – September 2017 TS5USBC400

PRODUCTION DATA.

请参考 PDF 数据表获取器件具体的封装图。

THERMAL METRIC ⁽¹⁾		TS5USBC400	UNIT
		YFP
		12 PINS
R_θJA	Junction-to-ambient thermal resistance	91.8	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	0.8	°C/W
R_θJB	Junction-to-board thermal resistance	22.8	°C/W
ψ_JT	Junction-to-top characterization parameter	0.5	°C/W
ψ_JB	Junction-to-board characterization parameter	23.0	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.