ZHCSCV1A June   2014  – July 2014 TSC2013-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configurations and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Handling Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements — I2C Standard Mode (ƒ(SCL) = 100 kHz)
    7. 6.7  Timing Requirements — I2C Fast Mode (ƒ(SCL) = 400 kHz)
    8. 6.8  Timing Requirements — I2C High-Speed Mode (ƒ(SCL) = 1.7 MHz)
    9. 6.9  Timing Requirements — I2C High-Speed Mode (ƒ(SCL) = 3.4 MHz)
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Touch-Screen Operation
      2. 7.3.2 4-Wire Touch Screen Measurements
      3. 7.3.3 Analog-to-Digital Converter
        1. 7.3.3.1 Data Format
        2. 7.3.3.2 Reference
        3. 7.3.3.3 Variable Resolution
        4. 7.3.3.4 Conversion Clock and Conversion Time
        5. 7.3.3.5 Touch Detect
        6. 7.3.3.6 Preprocessing
          1. 7.3.3.6.1 Preprocessing—Median Value Filter and Averaging Value Filter
    4. 7.4 Device Functional Modes
      1. 7.4.1 Conversion Controlled by TSC2013-Q1 and Initiated by TSC2013-Q1 (TSMode 1)
        1. 7.4.1.1 IX-IY Scan
        2. 7.4.1.2 X-Triplet, Y-Triplet, Z-Scan
      2. 7.4.2 Conversion Controlled by TSC2013-Q1 and Initiated by Host (TSMode 2)
      3. 7.4.3 Conversion Controlled by Host (TSMode 3)
    5. 7.5 Programming
      1. 7.5.1 I2C Interface
        1. 7.5.1.1 I2C Fast or Standard Mode (F-S Mode)
        2. 7.5.1.2 I2C High-Speed Mode (Hs Mode)
      2. 7.5.2 Digital Interface
        1. 7.5.2.1 Address Byte
      3. 7.5.3 Control Byte
        1. 7.5.3.1 Touch-Screen Scan Function for XYZ or XY
      4. 7.5.4 Start a Write Cycle
      5. 7.5.5 Register Access
      6. 7.5.6 Communication Protocol
      7. 7.5.7 Register Reset
    6. 7.6 Register Maps
      1. 7.6.1 Configuration and Status Registers
        1. 7.6.1.1 Configuration Register 0
          1. 7.6.1.1.1 Configuration Register 0 (address = 0) [reset = 4000h for read; 0000h for write]
        2. 7.6.1.2 Configuration Register 1 (address = Dh) [reset = 0000h]
        3. 7.6.1.3 Configuration Register 2 (address = Eh) [reset = 0000h]
        4. 7.6.1.4 Converter-Function Select Register (address = Fh) [reset = 0000h]
        5. 7.6.1.5 Status Register (address = 8h) [reset = 0004h]
      2. 7.6.2 Data Registers
        1. 7.6.2.1 X1, X2, IX, Y1, Y2, IY, Z1, Z2, and AUX registers (offset = see ) [reset = see ]
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Auxiliary Measurement
      2. 8.1.2 Single IX or Single IY Measurement
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Power-On-Reset and Reset Consideration
          1. 8.2.2.1.1 Power-On Reset
          2. 8.2.2.1.2 Requesting a Minimal t(SNSVDD_OFF) Time
          3. 8.2.2.1.3 Requesting a Minimal t(SNSVDD_OFF_ramp) and t(SNSVDD_ON_ramp) Ramp
          4. 8.2.2.1.4 Hardware Reset
          5. 8.2.2.1.5 Software Reset
        2. 8.2.2.2 Power Up Considerations
          1. 8.2.2.2.1 Power-Off Cycles During Normal Operation
          2. 8.2.2.2.2 Supply Glitches During Normal Operation
          3. 8.2.2.2.3 TSC2013-Q1 Digital Pins
          4. 8.2.2.2.4 Suggested Hardware Reset During Power-On
        3. 8.2.2.3 Device Timing Setup and Use
          1. 8.2.2.3.1 Touch-Panel Driving Power
          2. 8.2.2.3.2 ADC Clock Effects
        4. 8.2.2.4 Panel Voltage Stabilization Time
        5. 8.2.2.5 Precharge and Sense Time
        6. 8.2.2.6 Single-Touch Operation
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 商标
    2. 11.2 静电放电警告
    3. 11.3 术语表
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 器件和文档支持

11.1 商标

All other trademarks are the property of their respective owners.

11.2 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

11.3 术语表

SLYZ022 — TI 术语表。

这份术语表列出并解释术语、首字母缩略词和定义。
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