ZHCSHW9C March   2018  – July 2024 TUSB1002A

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 4-Level Control Inputs
      2. 6.3.2 Linear Equalization
      3. 6.3.3 Adjustable VOD Linear Range and DC Gain
      4. 6.3.4 USB3.2 Dual Channel Operation (MODE = “F”)
      5. 6.3.5 USB3.2 Single Channel Operation (MODE = “1”)
      6. 6.3.6 PCIe/SATA/SATA Express Redriver Operation (MODE = “R”; CFG1 = "0"; CFG2 = "0" )
      7. 6.3.7 Basic Redriver Operation (MODE = “0”)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown Mode
      2. 6.4.2 Disconnect Mode
    5. 6.5 U0 Mode
    6. 6.6 U1 Mode
    7. 6.7 U2/U3 Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical USB3.2 Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 ESD Protection
      4. 7.2.4 Application Curves
    3. 7.3 Typical SATA, PCIe and SATA Express Application
      1. 7.3.1 Design Requirements
      2. 7.3.2 Detailed Design Procedure
      3. 7.3.3 Application Curves
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 接收文档更新通知
    2. 8.2 支持资源
    3. 8.3 Trademarks
    4. 8.4 静电放电警告
    5. 8.5 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGE|24
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1)TUSB1002AUNIT
RGE (VQFN)
24 PINS
RθJAJunction-to-ambient thermal resistance38.5°C/W
RθJC(top)Junction-to-case (top) thermal resistance41.6°C/W
RθJBJunction-to-board thermal resistance16.3°C/W
ΨJTJunction-to-top characterization parameter1.0°C/W
ΨJBJunction-to-board characterization parameter16.4°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance6.9°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
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