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ZHCSGH5D August 2017 – May 2019 TUSB1042I

PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		TUSB1042I	UNIT
		RNQ (WQFN)
		40 PINS
R_θJA	Junction-to-ambient thermal resistance	37.6	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	20.7	°C/W
R_θJB	Junction-to-board thermal resistance	9.5	°C/W
ψ_JT	Junction-to-top characterization parameter	0.2	°C/W
ψ_JB	Junction-to-board characterization parameter	9.4	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	2.3	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.