9 Revision History
Changes from Revision C (October 2018) to Revision D (April 2024)
- Changed condition for I2C VIH-3.3V From VIO_SEL = "0" or
"R". To VIO_SEL = "0" or "F".Go
- Changed condition for I2C VIL-3.3V From VIO_SEL = "0" or
"R". To VIO_SEL = "0" or "F".Go
- Changed condition for I2C VIH-1.8V From VIO_SEL = "F" or
"1". To VIO_SEL = "R" or "1".Go
- Changed condition for I2C VIL-1.8V From VIO_SEL = "F" or
"1". To VIO_SEL = "R" or "1".Go
- Changed dR maximum from 8.1 Gbps to 10.0 Gbps Go
- Changed 8.1 Gbps to 10.0 GbpsGo
- Changed DisplayPort 1.4 to DisplayPort 2.1Go
- Changed HBR3 to UHBR10Go
Changes from Revision B (April 2018) to Revision C (October 2018)
- Added pull-down indicator (PD) in the I/O column on SWAP, SLP_S0#,
DIR0, DIR1, FLIP. CTL0 pins. Go
- Added junction temperature of 105℃ for TUSB1044. Go
- Changed junction temperature from 105℃ to 125℃ for TUSB1044I Go
- Changed RPD_CTL1 From: Internal pull-down resistance for
CTL1 To: Internal pull-down resistance for CTL1, CTL0, DIR0, DIR1, FLIP, and
SLP_S0#.Go
- Added RPD_SWAP parameter of 200kΩ.Go
Changes from Revision A (February 2018) to Revision B (April 2018)
Changes from Revision * (February 2018) to Revision A (February 2018)
- Changed text in the Detailed Design Procedure From: "This AC-coupling capacitor should be no more than 220 nF." To: This AC-coupling capacitor should be no smaller than 297 nF. A value of 330 nF is recommended."Go
- Changed 220 nF to 330 nF on DRX2P, DRX2N and DRX1P, DRX1N in Figure 7-2
Go