RXP/N and TXP/N pairs should be routed with controlled 90-Ω differential impedance (± 15%).
Keep away from other high speed signals.
Intra-pair routing should be kept to within 2 mils.
Length matching should be near the location of mismatch.
Each pair should be separated at least by 3 times the signal trace width.
The use of bends in differential traces should be kept to a minimum. When bends are used, the number of left and right bends should be as equal as possible and the angle of the bend should be ≥ 135 degrees. This will minimize any length mismatch causes by the bends and therefore minimize the impact bends have on EMI.
Route all differential pairs on the same of layer.
The number of VIAS should be kept to a minimum. It is recommended to have no more than 1 VIA between TUSB1044 and Type-C connector and no more than 1 VIA between TUSB1044 and USB3.1 Device/Host.
Keep traces on layers adjacent to ground plane.
Do NOT route differential pairs over any plane split.
Adding Test points will cause impedance discontinuity; and therefore, negatively impacts signal performance. If test points are used, the test points should be placed in series and symmetrically. The test points must not be placed in a manner that causes a stub on the differential pair.
Assuming 1 dB/inch loss at 5 GHz, the trace length between TUSB1044 and Type-C connector should be no more than 1.5 inches.
Assuming 1 dB/inch loss at 5 GHz, the trace length between TUSB1044 and the USB 3.1 Host/Device should be no more than 8 inches.
ESD protection devices and EMI suppression devices need to be carefully selected and have to have excellent transient performance at 10 Gbps with flat shunt capacitance characteristics over ±650 mV voltage range. Note small-signal insertion loss characteristics are insufficient to determine suitability of non-linear devices (ESD devices) for 10Gbps operation