SLLSE32G November   2010  – November 2017 TUSB1310A

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Pin Configuration and Functions
    1. 3.1 Pin Attributes
    2. 3.2 Configuration Pins
    3. 3.3 Signal Descriptions
      1. 3.3.1 PIPE
      2. 3.3.2 ULPI
      3. 3.3.3 Clocking
      4. 3.3.4 JTAG Interface
      5. 3.3.5 Reset and Output Control Interface
      6. 3.3.6 Strap Options
      7. 3.3.7 USB Interfaces
      8. 3.3.8 Special Connect
      9. 3.3.9 Power and Ground
  4. 4Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Device Power-Consumption Summary
    5. 4.5 DC Characteristics for 1.8-V Digital I/O
    6. 4.6 Thermal Characteristics
    7. 4.7 Timing Characteristics
      1. 4.7.1 Power-Up and Reset Timing
      2. 4.7.2 PIPE Transmit
      3. 4.7.3 PIPE Receive
      4. 4.7.4 ULPI Parameters
      5. 4.7.5 ULPI Clock
      6. 4.7.6 ULPI Transmit
      7. 4.7.7 ULPI Receive Timing
    8. 4.8 Typical Characteristics
  5. 5Detailed Description
    1. 5.1 Overview
    2. 5.2 Functional Block Diagram
    3. 5.3 Feature Description
      1. 5.3.1 Power On and Reset
        1. 5.3.1.1 RESETN and PHY_RESETN: Hardware Reset
        2. 5.3.1.2 ULPI Reset: Software Reset
        3. 5.3.1.3 OUT_ENABLE: Output Enable
        4. 5.3.1.4 Power-Up Sequence
      2. 5.3.2 Clocks
        1. 5.3.2.1 Clock Distribution
        2. 5.3.2.2 Output Clock
      3. 5.3.3 Power State Transition Time
      4. 5.3.4 Power Management
        1. 5.3.4.1 USB Power Management
      5. 5.3.5 Receiver Status
        1. 5.3.5.1 Clock Tolerance Compensation
        2. 5.3.5.2 Receiver Detection
        3. 5.3.5.3 8b/10b Decode Errors
        4. 5.3.5.4 Elastic Buffer Errors
        5. 5.3.5.5 Disparity Errors
      6. 5.3.6 Loopback
      7. 5.3.7 Adaptive Equalizer
    4. 5.4 Device Functional Modes
      1. 5.4.1 USB 3.0 Mode
      2. 5.4.2 USB 2.0 Mode
      3. 5.4.3 ULPI Modes
    5. 5.5 Register Maps
      1. 5.5.1  Vendor ID and Product ID (00h-03h)
      2. 5.5.2  Function Control (04h-06h)
      3. 5.5.3  Interface Control (07h-09h)
      4. 5.5.4  OTG Control
      5. 5.5.5  USB Interrupt Enable Rising (0Dh-0Fh)
      6. 5.5.6  USB Interrupt Enable Falling (10h-12h)
      7. 5.5.7  USB Interrupt Status (13h)
      8. 5.5.8  USB Interrupt Latch (14h)
      9. 5.5.9  Debug (15h)
      10. 5.5.10 Scratch Register (16-18h)
  6. 6Application, Implementation, and Layout
    1. 6.1 Application Information
    2. 6.2 Typical Application
      1. 6.2.1 Design Requirements
        1. 6.2.1.1 Clock Source Requirements
          1. 6.2.1.1.1 Clock Source Selection Guide
          2. 6.2.1.1.2 Oscillator
          3. 6.2.1.1.3 Crystal
      2. 6.2.2 Detailed Design Procedure
        1. 6.2.2.1 Chip Connection on PCB
          1. 6.2.2.1.1 USB Connector Pins Connection
          2. 6.2.2.1.2 Clock Connections
      3. 6.2.3 Application Curve
      4. 6.2.4 Layout
        1. 6.2.4.1 Layout Guidelines
          1. 6.2.4.1.1 High-Speed Differential Routing
          2. 6.2.4.1.2 SuperSpeed Differential Routing
        2. 6.2.4.2 Layout Example
    3. 6.3 Power Supply Recommendations
      1. 6.3.1 1.1-V and 1.8-V Digital Supply
      2. 6.3.2 1.1-V, 1.8-V and 3.3-V Analog Supplies
      3. 6.3.3 Capacitor Selection Recommendations
  7. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
      2. 7.1.2 Community Resources
    2. 7.2 Trademarks
    3. 7.3 Electrostatic Discharge Caution
    4. 7.4 Glossary
  8. 8Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

2 Revision History

Changes from F Revision (August 2015) to G Revision

  • Changed the device to Not Recommended for New Designs Go
  • Changed sentence From: "The SuperSpeed USB contains SSTXP/SSTXN and SSRXP/SSRXP..." To: "The SuperSpeed USB contains SSTXP/SSTXN and SSRXP/SSRXN..." in the Overview section Go

Changes from E Revision (July 2012) to F Revision

  • Added Pin Configuration and Functions section, storage temperature to the Absolute Maximum Ratings table, ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Added parameter names to the DC Characteristics for 1.8-V Digital I/O tableGo
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