ZHCSDU0F May   2015  – March 2022 TUSB320

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
      1. 7.2.1 Cables, Adapters, and Direct Connect Devices
        1. 7.2.1.1 USB Type-C Receptacles and Plugs
        2. 7.2.1.2 USB Type-C Cables
        3. 7.2.1.3 Legacy Cables and Adapters
        4. 7.2.1.4 Direct Connect Devices
        5. 7.2.1.5 Audio Adapters
    3. 7.3 Feature Description
      1. 7.3.1 Port Role Configuration
        1. 7.3.1.1 Downstream Facing Port (DFP) – Source
        2. 7.3.1.2 Upstream Facing Port (UFP) – Sink
        3. 7.3.1.3 Dual Role Port (DRP)
      2. 7.3.2 Type-C Current Mode
      3. 7.3.3 Accessory Support
        1. 7.3.3.1 Audio Accessory
        2. 7.3.3.2 Debug Accessory
      4. 7.3.4 I2C and GPIO Control
      5. 7.3.5 VBUS Detection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Unattached Mode
      2. 7.4.2 Active Mode
      3. 7.4.3 Dead Battery Mode
      4. 7.4.4 Shutdown Mode
    5. 7.5 Programming
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 DRP in I2C Mode
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 DFP in I2C Mode
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 UFP in I2C Mode
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curves
    3. 8.3 Initialization Set Up
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 接收文档更新通知
    2. 11.2 支持资源
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.2.2.1 Design Requirements

For this design example, use the parameters listed in Table 8-3:

Table 8-3 Design Requirements for DFP in I2C Mode
DESIGN PARAMETERVALUE
VDD (2.75 V to 5 V)5 V
Mode (I2C or GPIO)I2C
ADDR pin must be pulled down or pulled up
I2C address (0x61 or 0x60)0x60
ADDR pin must be pulled low or tied to GND
Type-C port type (UFP, DFP, or DRP)DFP
PORT pin is pulled up
Shutdown support (EN_N Control)No
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |