ZHCSDZ0C July   2015  – July 2024 TUSB4020BI-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 3.3V I/O Electrical Characteristics
    6. 5.6 Hub Input Supply Current
    7. 5.7 Power-Up Timing Requirements
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Battery Charging Features
      2. 6.3.2 USB Power Management
      3. 6.3.3 Clock Generation
      4. 6.3.4 Power-Up and Reset
    4. 6.4 Device Functional Modes
      1. 6.4.1 External Configuration Interface
    5. 6.5 Programming
      1. 6.5.1 One-Time Programmable (OTP) Configuration
      2. 6.5.2 I2C EEPROM Operation
      3. 6.5.3 SMBus Target Operation
    6. 6.6 Register Maps
      1. 6.6.1 Configuration Registers
        1. 6.6.1.1  ROM Signature Register (offset = 0h) [reset = 0h]
        2. 6.6.1.2  Vendor ID LSB Register (offset = 1h) [reset = 51h]
        3. 6.6.1.3  Vendor ID MSB Register (offset = 2h) [reset = 4h]
        4. 6.6.1.4  Product ID LSB Register (offset = 3h) [reset = 25h]
        5. 6.6.1.5  Product ID MSB Register (offset = 4h) [reset = 80h]
        6. 6.6.1.6  Device Configuration Register (offset = 5h) [reset = 1Xh]
        7. 6.6.1.7  Battery Charging Support Register (offset = 6h) [reset = 0Xh]
        8. 6.6.1.8  Device Removable Configuration Register (offset = 7h) [reset = 0Xh]
        9. 6.6.1.9  Port Used Configuration Register (offset = 8h) [reset = 0h]
        10. 6.6.1.10 PHY Custom Configuration Register (offset = 9h) [reset = 0h]
        11. 6.6.1.11 Device Configuration Register 2 (offset = Ah)
        12. 6.6.1.12 UUID Registers (offset = 10h to 1Fh)
        13. 6.6.1.13 Language ID LSB Register (offset = 20h)
        14. 6.6.1.14 Language ID MSB Register (offset = 21h)
        15. 6.6.1.15 Serial Number String Length Register (offset = 22h)
        16. 6.6.1.16 Manufacturer String Length Register (offset = 23h)
        17. 6.6.1.17 Product String Length Register (offset = 24h)
        18. 6.6.1.18 Serial Number Registers (offset = 30h to 4Fh)
        19. 6.6.1.19 Manufacturer String Registers (offset = 50h to 8Fh)
        20. 6.6.1.20 Product String Registers (offset = 90h to CFh)
        21. 6.6.1.21 Additional Feature Configuration Register (offset = F0h)
        22. 6.6.1.22 Charging Port Control Register (offset = F2h)
        23. 6.6.1.23 Device Status and Command Register (offset = F8h)
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Crystal Requirements
      2. 7.1.2 Input Clock Requirements
    2. 7.2 Typical Applications
      1. 7.2.1 Upstream Port Implementation
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Downstream Port 1 Implementation
      3. 7.2.3 Downstream Port 2 Implementation
      4. 7.2.4 VBUS Power Switch Implementation
      5. 7.2.5 Clock, Reset, and Miscellaneous
      6. 7.2.6 Power Implementation
  9. 8 Power Supply Recommendations
    1. 8.1 Power Supply
    2. 8.2 Downstream Port Power
    3. 8.3 Ground
  10. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Placement
      2. 9.1.2 Package Specific
      3. 9.1.3 Differential Pairs
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted)(1)
MIN MAX UNIT
Supply Voltage VDD Steady-state supply voltage –0.3 1.4 V
VDD33 Steady-state supply voltage –0.3 3.8 V
Voltage USB_VBUS pin –0.3 1.4 V
XI and XO pins –0.4 2.45 V
All other pins –0.3 3.8 V
TJ Operating junction temperature –40 125 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
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