ZHCSDY5C July   2015  – July 2024 TUSB4041I-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 3.3-V I/O Electrical Characteristics
    6. 5.6 Power-Up Timing Requirements
    7. 5.7 Hub Input Supply Current
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Battery Charging Features
      2. 6.3.2 USB Power Management
      3. 6.3.3 One-Time Programmable Configuration
      4. 6.3.4 Clock Generation
      5. 6.3.5 Crystal Requirements
      6. 6.3.6 Input Clock Requirements
      7. 6.3.7 Power-Up and Reset
    4. 6.4 Device Functional Modes
      1. 6.4.1 External Configuration Interface
      2. 6.4.2 I2C EEPROM Operation
      3. 6.4.3 SMBus Target Operation
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Upstream Port Implementation
        2. 7.2.2.2 Downstream Port 1 Implementation
        3. 7.2.2.3 Downstream Port 2 Implementation
        4. 7.2.2.4 Downstream Port 3 Implementation
        5. 7.2.2.5 Downstream Port 4 Implementation
        6. 7.2.2.6 VBUS Power Switch Implementation
        7. 7.2.2.7 Clock, Reset, and Miscellaneous
        8. 7.2.2.8 TUSB4041I-Q1 Power Implementation
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 TUSB4041I-Q1 Power Supply
      2. 7.3.2 Downstream Port Power
      3. 7.3.3 Ground
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Placement
        2. 7.4.1.2 Package Specific
        3. 7.4.1.3 Differential Pairs
      2. 7.4.2 Layout Example
  9. 8 Register Maps
    1. 8.1  Configuration Registers
    2. 8.2  ROM Signature Register
    3. 8.3  Vendor ID LSB Register
    4. 8.4  Vendor ID MSB Register
    5. 8.5  Product ID LSB Register
    6. 8.6  Product ID MSB Register
    7. 8.7  Device Configuration Register
    8. 8.8  Battery Charging Support Register
    9. 8.9  Device Removable Configuration Register
    10. 8.10 Port Used Configuration Register
    11. 8.11 Device Configuration Register 2
    12. 8.12 USB 2.0 Port Polarity Control Register
    13. 8.13 UUID Byte N Register
    14. 8.14 Language ID LSB Register
    15. 8.15 Language ID MSB Register
    16. 8.16 Serial Number String Length Register
    17. 8.17 Manufacturer String Length Register
    18. 8.18 Product String Length Register
    19. 8.19 Serial Number String Registers
    20. 8.20 Manufacturer String Registers
    21. 8.21 Product String Byte N Register
    22. 8.22 Additional Feature Configuration Register
    23. 8.23 Device Status and Command Register
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage VDD steady-state supply voltage –0.3 1.4 V
VDD33 steady-state supply voltage –0.3 3.8 V
Voltage USB_VBUS pin –0.3 1.4 V
XI pins –0.3 2.45 V
All other pins –0.3 3.8 V
Junction temperature, TJ(max) –40 125 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated as Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
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