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ZHCSFL6E July 2016 – November 2023 TUSB522P

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		TUSB522P	UNIT
		RGE (VQFN)
		24 PINS
R_θJA	Junction-to-ambient thermal resistance	51.2	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	55.9	°C/W
R_θJB	Junction-to-board thermal resistance	28.3	°C/W
ψ_JT	Junction-to-top characterization parameter	2.0	°C/W
ψ_JB	Junction-to-board characterization parameter	28.3	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	9.7	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.