ZHCSKL2A December   2019  – May 2022 TUSS4470

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power-Up Characteristics
    6. 6.6  Transducer Drive
    7. 6.7  Receiver Characteristics
    8. 6.8  Echo Interrupt Comparator Characteristics
    9. 6.9  Digital I/O Characteristics
    10. 6.10 Switching Characteristics
    11. 6.11 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Excitation Power Supply (VDRV)
      2. 7.3.2 Burst Generation
        1. 7.3.2.1 Burst Generation Diagnostics
      3. 7.3.3 Direct Transducer Drive
      4. 7.3.4 Analog Front End
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
    6. 7.6 Register Maps
      1. 7.6.1 REG_USER Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Transducer Drive Configuration Options
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Transducer Driving Voltage
          2. 8.2.1.2.2 Transducer Driving Frequency
          3. 8.2.1.2.3 Transducer Pulse Count
        3. 8.2.1.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 接收文档更新通知
    2. 11.2 支持资源
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1)TUSS4470UNIT
RTJ (WQFN)
20 PINS
RθJAJunction-to-ambient thermal resistance36.3°C/W
RθJC(top)Junction-to-case (top) thermal resistance29.4°C/W
RθJBJunction-to-board thermal resistance14.7°C/W
ΨJTJunction-to-top characterization parameter0.4°C/W
ΨJBJunction-to-board characterization parameter14.7°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance4.7°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
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