米6体育平台手机版

ZHCSHT0A December 2017 – March 2018 TVS2700

PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		TVS2700	UNIT
		DRV (SON)
		6 PINS
R_qJA	Junction-to-ambient thermal resistance	70.4	°C/W
R_qJC(top)	Junction-to-case (top) thermal resistance	73.7	°C/W
R_qJB	Junction-to-board thermal resistance	40	°C/W
Y_JT	Junction-to-top characterization parameter	2.2	°C/W
Y_JB	Junction-to-board characterization parameter	40.3	°C/W
R_qJC(bot)	Junction-to-case (bottom) thermal resistance	11	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.