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ZHCSIV5B September 2018 – September 2022 TVS3301

PRODUCTION DATA

8.5 Thermal Information

THERMAL METRIC⁽¹⁾		TVS3301	UNIT
		DRB (SON)
		8 PINS
R_qJA	Junction-to-ambient thermal resistance	52.0	°C/W
R_qJC(top)	Junction-to-case (top) thermal resistance	56.1	°C/W
R_qJB	Junction-to-board thermal resistance	24.9	°C/W
Y_JT	Junction-to-top characterization parameter	2.1	°C/W
Y_JB	Junction-to-board characterization parameter	24.8	°C/W
R_qJC(bot)	Junction-to-case (bottom) thermal resistance	9.8	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.