ZHCSI11A August   2009  – April 2018 TXB0106-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型工作电路
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements – VCCA = 1.2 V, TA = 25°C
    7. 6.7  Timing Requirements – VCCA = 1.5 V ± 0.1 V
    8. 6.8  Timing Requirements – VCCA = 1.8 V ± 0.15 V
    9. 6.9  Timing Requirements – VCCA = 2.5 V ± 0.2 V
    10. 6.10 Timing Requirements – VCCA = 3.3 V ± 0.3 V
    11. 6.11 Switching Characteristics –VCCA = 1.2 V, TA = 25°C
    12. 6.12 Switching Characteristics – VCCA = 1.5 V ± 0.1 V
    13. 6.13 Switching Characteristics – VCCA = 1.8 V ± 0.15 V
    14. 6.14 Switching Characteristics – VCCA = 2.5 V ± 0.2 V
    15. 6.15 Switching Characteristics – VCCA = 3.3 V ± 0.3 V
    16. 6.16 Operating Characteristics
    17. 6.17 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Architecture
      2. 8.3.2 Input Driver Requirements
      3. 8.3.3 Power Up
      4. 8.3.4 Output Load Considerations
      5. 8.3.5 Enable and Disable
      6. 8.3.6 Pullup or Pulldown Resistors on I/O Lines
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 接收文档更新通知
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9.1 Application Information

The TXB0106-Q1 device can be used in level-translation applications for interfacing devices or systems operating at different interface voltages with one another. It can only translate push-pull CMOS logic outputs. For open-drain signal translation, see TI's TXS products. Any external pulldown or pullup resistors are recommended to be larger than 50 kΩ.
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