ZHCSCI1F November   2013  – October 2024 TXS0104E-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements—VCCA = 1.8 V ± 0.15 V
    7. 5.7  Timing Requirements—VCCA = 2.5 V ± 0.2 V
    8. 5.8  Timing Requirements—VCCA = 3.3 V ± 0.3 V
    9. 5.9  Switching Characteristics—VCCA = 1.8 V ± 0.15 V
    10. 5.10 Switching Characteristics—VCCA = 2.5 V ± 0.2 V
    11. 5.11 Switching Characteristics—VCCA = 3.3 V ± 0.3 V
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Load Circuits
    2. 6.2 Voltage Waveforms
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Power Up
      4. 7.3.4 Enable and Disable
      5. 7.3.5 Pull Up and Pull Down Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
  11. 10静电放电警告
  12. 11术语表
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RUT|12
  • PW|14
  • BQA|14
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.4.1 Layout Guidelines

For reliability of the device, following common printed-circuit board layout guidelines is recommended.

  • Bypass capacitors should be used on power supplies.
  • Short trace lengths should be used to avoid excessive loading.
  • PCB signal trace-lengths must be kept short enough so that the round-trip delay of any reflection is less than the one shot duration, approximately 30 ns, ensuring that any reflection encounters low impedance at the source driver.
  • Placing pads on the signal paths for loading capacitors or pullup resistors to help adjust rise and fall times of signals depending on the system requirements
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