ZHCSCI1F November   2013  – October 2024 TXS0104E-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements—VCCA = 1.8 V ± 0.15 V
    7. 5.7  Timing Requirements—VCCA = 2.5 V ± 0.2 V
    8. 5.8  Timing Requirements—VCCA = 3.3 V ± 0.3 V
    9. 5.9  Switching Characteristics—VCCA = 1.8 V ± 0.15 V
    10. 5.10 Switching Characteristics—VCCA = 2.5 V ± 0.2 V
    11. 5.11 Switching Characteristics—VCCA = 3.3 V ± 0.3 V
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Load Circuits
    2. 6.2 Voltage Waveforms
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Power Up
      4. 7.3.4 Enable and Disable
      5. 7.3.5 Pull Up and Pull Down Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
  11. 10静电放电警告
  12. 11术语表
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RUT|12
  • PW|14
  • BQA|14
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

over operating free-air temperature range (unless otherwise noted) (1)
THERMAL METRIC(1) TXS0104E-Q1 UNIT
PW (TSSOP)

BQA (WQFN)

RUT (UQFN)
14 PINS

14 PINS

12 PINS
RθJA Junction-to-ambient thermal resistance 115.2

73.5

150.4

 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 46.2

76.9

68.6

 °C/W
RθJB Junction-to-board thermal resistance

70.9

43.0

76.3

 °C/W
ψJT Junction-to-top characterization parameter

3.4

4.7

2.4

 °C/W
ψJB Junction-to-board characterization parameter 70.2

42.9

76.2

 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance —

19.6

—

 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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