ZHCSMY0B April   2021  – March 2022 TXU0204-Q1

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Related Products
  6. Pin Configuration and Functions—TXU0204-Q1
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Switching Characteristics: Tsk, TMAX
    7. 7.7  Switching Characteristics, VCCA = 1.2 ± 0.1 V
    8. 7.8  Switching Characteristics, VCCA = 1.5 ± 0.1 V
    9. 7.9  Switching Characteristics, VCCA = 1.8 ± 0.15 V
    10. 7.10 Switching Characteristics, VCCA = 2.5 ± 0.2 V
    11. 7.11 Switching Characteristics, VCCA = 3.3 ± 0.3 V
    12. 7.12 Switching Characteristics, VCCA = 5.0 ± 0.5 V
    13. 7.13 Operating Characteristics
    14. 7.14 Typical Characteristics
  8. Parameter Measurement Information
    1. 8.1 Load Circuit and Voltage Waveforms
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  CMOS Schmitt-Trigger Inputs with Integrated Pulldowns
        1. 9.3.1.1 Inputs with Integrated Static Pull-Down Resistors
      2. 9.3.2  Control Logic (OE) with VCC(MIN) Circuitry
      3. 9.3.3  Balanced High-Drive CMOS Push-Pull Outputs
      4. 9.3.4  Partial Power Down (Ioff)
      5. 9.3.5  VCC Isolation and VCC Disconnect
      6. 9.3.6  Over-Voltage Tolerant Inputs
      7. 9.3.7  Glitch-Free Power Supply Sequencing
      8. 9.3.8  Negative Clamping Diodes
      9. 9.3.9  Fully Configurable Dual-Rail Design
      10. 9.3.10 Supports High-Speed Translation
      11. 9.3.11 Wettable Flanks
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Regulatory Requirements
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 接收文档更新通知
    4. 13.4 支持资源
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 术语表
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

支持资源

TI E2E™ 支持论坛是工程师的重要参考资料,可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解答或提出自己的问题可获得所需的快速设计帮助。

链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范,并且不一定反映 TI 的观点;请参阅 TI 的《使用条款》