米6体育平台手机版

ZHCSHE5G November 1970 – January 2018

PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		µA741			UNIT
		D (SOIC)	P (PDIP)	PS (SO)
		8 PINS	8 PINS	8 PINS
R_θJA	Junction-to-ambient thermal resistance	129.2	87.4	119.7	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	73.6	89.3	66	°C/W
R_θJB	Junction-to-board thermal resistance	72.4	64.4	70	°C/W
ψ_JT	Junction-to-top characterization parameter	25.9	49.8	27.2	°C/W
ψ_JB	Junction-to-board characterization parameter	71.7	64.1	69	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.