ZHCSMC3X january   1976  – june 2023 UA78L

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: UA78L02 (Legacy Chip Only)
    6. 6.6  Electrical Characteristics: UA78L033 (New Chip Only)
    7. 6.7  Electrical Characteristics: UA78L05 (Both Legacy and New Chip)
    8. 6.8  Electrical Characteristics: UA78L12 (Both Legacy and New Chip)
    9. 6.9  Electrical Characteristics: UA78L06 (Legacy Chip Only)
    10. 6.10 Electrical Characteristics: UA78L08 (Legacy Chip Only)
    11. 6.11 Electrical Characteristics: UA78L09 (Legacy Chip Only)
    12. 6.12 Electrical Characteristics: UA78L10 (Legacy Chip Only)
    13. 6.13 Electrical Characteristics: UA78L15 (Both Legacy and New Chip)
    14. 6.14 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Current Limit
      2. 7.3.2 Thermal Shutdown
      3. 7.3.3 Dropout Voltage (VDO)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
  9. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitor Requirements
        2. 8.2.2.2 Power Dissipation (PD)
        3. 8.2.2.3 Estimating Junction Temperature
        4. 8.2.2.4 External Capacitor Requirements
        5. 8.2.2.5 Overload Recovery
        6. 8.2.2.6 Reverse Current
        7. 8.2.2.7 Polarity Reversal Protection
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 Positive Regulator in Negative Configuration
      2. 8.3.2 Current Limiter Circuit
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Evaluation Module
      2. 9.1.2 Device Nomenclature
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
  • PK|3
  • LP|3
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) UA78L00 UNIT
D (SOIC) LP (TO-92) PK (SOT-89)
8 PINS 3 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance 115 143.6 54.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 60.3 74.4 88.1 °C/W
RθJB Junction-to-board thermal resistance 55.6 — 9.6 °C/W
ψJT Junction-to-top characterization parameter 16.2 24.2 6.2 °C/W
ψJB Junction-to-board characterization parameter 55 120.9 9.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — — 7.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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