ZHCSUB8U June   1976  – May 2024

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: UA78M33 (Both Legacy and New Chip)
    6. 5.6  Electrical Characteristics: UA78M05 (Both Legacy and New Chip)
    7. 5.7  Electrical Characteristics: UA78M06C (Legacy Chip Only)
    8. 5.8  Electrical Characteristics: UA78M08C (Legacy Chip Only)
    9. 5.9  Electrical Characteristics: UA78M09 (Legacy Chip Only)
    10. 5.10 Electrical Characteristics: UA78M10 (Legacy Chip Only)
    11. 5.11 Electrical Characteristics: UA78M12 (Legacy Chip Only)
    12. 5.12 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Current Limit
      2. 6.3.2 Dropout Voltage (VDO)
      3. 6.3.3 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input and Output Capacitor Requirements
        2. 7.2.2.2 Power Dissipation (PD)
        3. 7.2.2.3 Estimating Junction Temperature
        4. 7.2.2.4 External Capacitor Requirements
        5. 7.2.2.5 Overload Recovery
        6. 7.2.2.6 Reverse Current
        7. 7.2.2.7 Polarity Reversal Protection
      3. 7.2.3 Application Curves
    3. 7.3 System Examples
      1. 7.3.1 Positive Regulator in Negative Configuration
      2. 7.3.2 Current Limiter Circuit
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Evaluation Module
      2. 8.1.2 Device Nomenclature
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • KVU|3
  • DCY|4
  • KCS|3
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1) UA78Mxx UNIT
DCY (Legacy Chip) DCY (New Chip) KCS (Legacy Chip only) KVU (Legacy Chip only)
3 PINS 3 PINS 3 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance 53 77.7 19 30.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 30.6 44.6 17 – °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance – – 3 – °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
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