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ZHCSDP1E January 2009 – February 2019 UC1842A-SP , UC1844A-SP

PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		UC184xA-SP		UNIT
		JG (CDIP)	FK (LCCC)
		8 PINS	20 PINS
R_θJA	Junction-to-ambient thermal resistance	103	—	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	9.6	9.0	°C/W
R_θJB	Junction-to-board thermal resistance	69.2	—	°C/W
ψ_JT	Junction-to-top characterization parameter	13.9	—	°C/W
ψ_JB	Junction-to-board characterization parameter	73	—	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.