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ZHCSOX6C September   2021  – December 2022 UCC14240-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Electrical Characteristics
    9. 6.9  Safety Limiting Values
    10. 6.10 Insulation Characteristics
    11. 6.11 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Stage Operation
        1. 7.3.1.1 VDD-VEE Voltage Regulation
        2. 7.3.1.2 COM-VEE Voltage Regulation
        3. 7.3.1.3 Power Handling Capability
      2. 7.3.2 Output Voltage Soft Start
      3. 7.3.3 ENA and PG
      4. 7.3.4 Protection Functions
        1. 7.3.4.1 Input Undervoltage Lockout
        2. 7.3.4.2 Input Overvoltage Lockout
        3. 7.3.4.3 Output Overvoltage Protection
        4. 7.3.4.4 Overpower Protection
          1. 7.3.4.4.1 Output Undervoltage Protection
        5. 7.3.4.5 Overtemperature Protection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Capacitor Selection
        2. 8.2.2.2 RLIM Resistor Selection
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 术语表
  10. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) UNIT
DWN (SSOP)
36 PINS
RθJA Junction-to-ambient thermal resistance 52.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 28.5 °C/W
RθJB Junction-to-board thermal resistance 25.9 °C/W
ΨJT Junction-to-top characterization parameter 16.6 °C/W
ΨJB Junction-to-board characterization parameter 25.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance – °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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