ZHCSJ23C November   2018  – September 2019 UCC20225-Q1 , UCC20225A-Q1

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      功能方框图
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Switching Characteristics
    11. 6.11 Thermal Derating Curves
    12. 6.12 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1 Propagation Delay and Pulse Width Distortion
    2. 7.2 Rising and Falling Time
    3. 7.3 PWM Input and Disable Response Time
    4. 7.4 Programable Dead Time
    5. 7.5 Power-up UVLO Delay to OUTPUT
    6. 7.6 CMTI Testing
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 VDD, VCCI, and Under Voltage Lock Out (UVLO)
      2. 8.3.2 Input and Output Logic Table
      3. 8.3.3 Input Stage
      4. 8.3.4 Output Stage
      5. 8.3.5 Diode Structure in UCC20225-Q1 family
    4. 8.4 Device Functional Modes
      1. 8.4.1 Disable Pin
      2. 8.4.2 Programmable Dead Time (DT) Pin
        1. 8.4.2.1 Tying the DT Pin to VCC
        2. 8.4.2.2 DT Pin Left Open or Connected to a Programming Resistor between DT and GND Pins
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Designing PWM Input Filter
        2. 9.2.2.2 Select External Bootstrap Diode and its Series Resistor
        3. 9.2.2.3 Gate Driver Output Resistor
        4. 9.2.2.4 Estimate Gate Driver Power Loss
        5. 9.2.2.5 Estimating Junction Temperature
        6. 9.2.2.6 Selecting VCCI, VDDA/B Capacitor
          1. 9.2.2.6.1 Selecting a VCCI Capacitor
          2. 9.2.2.6.2 Selecting a VDDA (Bootstrap) Capacitor
          3. 9.2.2.6.3 Select a VDDB Capacitor
        7. 9.2.2.7 Dead Time Setting Guidelines
        8. 9.2.2.8 Application Circuits with Output Stage Negative Bias
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 相关链接
    2. 12.2 文档支持
      1. 12.2.1 相关文档
    3. 12.3 认证
    4. 12.4 接收文档更新通知
    5. 12.5 社区资源
    6. 12.6 商标
    7. 12.7 静电放电警告
    8. 12.8 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Insulation Specifications

PARAMETER TEST CONDITIONS VALUE UNIT
CLR External clearance(1)(2) Shortest pin-to-pin distance through air 3.5 mm
CPG External creepage(1) Shortest pin-to-pin distance across the package surface 3.5 mm
DTI Distance through the insulation Minimum internal gap (internal clearance) >21 µm
CTI Comparative tracking index DIN EN 60112 (VDE 0303-11); IEC 60112 > 600 V
Material group I
Overvoltage category per IEC 60664-1 Rated mains voltage ≤ 150 VRMS I-III
Rated mains voltage ≤ 300 VRMS I-II
DIN V VDE V 0884-11 (VDE V 0884-11): 2017-01(3)
VIORM Maximum repetitive peak isolation voltage AC voltage (bipolar) 792 VPK
VIOWM Maximum working isolation voltage AC voltage (sine wave); time dependent dielectric breakdown (TDDB) test; (See Figure 1) 560 VRMS
DC Voltage 792 VDC
VIOTM Maximum transient isolation voltage VTEST = VIOTM, t = 60 s (qualification); VTEST = 1.2 × VIOTM, t = 1 s (100% production) 3535 VPK
VIOSM Maximum surge isolation voltage(4) Test method per IEC 62368-1, 1.2/50 μs waveform, VTEST = 1.3 × VIOSM (qualification) 3500 VPK
qpd Apparent charge(5) Method a, After Input/Output safety test subgroup 2/3,
Vini = VIOTM, tini = 60s;
Vpd(m) = 1.2 × VIORM, tm = 10s
<5 pC
Method a, After environmental tests subgroup 1,
Vini = VIOTM, tini = 60s;
Vpd(m) = 1.2 × VIORM, tm = 10s
<5
Method b1; At routine test (100% production) and preconditioning (type test)
Vini = 1.2 × VIOTM; tini = 1 s;
Vpd(m) = 1.5 × VIORM , tm = 1s
<5
CIO Barrier capacitance, input to output(6) VIO = 0.4 sin (2πft), f =1 MHz 1.2 pF
RIO Isolation resistance, input to output VIO = 500 V at TA = 25°C > 1012 Ω
VIO = 500 V at 100°C ≤ TA ≤ 125°C > 1011
VIO = 500 V at TS =150°C > 109
Pollution degree 2
Climatic category 40/125/21
UL 1577
VISO Withstand isolation voltage VTEST = VISO = 3000 VRMS, t = 60 sec. (qualification),
VTEST = 1.2 × VISO = 3000VRMS, t = 1 sec (100% production)
2500 VRMS
Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printed-circuit board do not reduce this distance. Creepage and clearance on a printed-circuit board become equal in certain cases. Techniques such as inserting grooves, ribs, or both on a printed circuit board are used to help increase these specifications.
Package dimension tolerance ± 0.05mm.
This coupler is suitable for basic electrical insulation only within the maximum operating ratings. Compliance with the safety ratings shall be ensured by means of suitable protective circuits.
Testing is carried out in air or oil to determine the intrinsic surge immunity of the isolation barrier.
Apparent charge is electrical discharge caused by a partial discharge (pd).
All pins on each side of the barrier tied together creating a two-pin device.