米6体育平台手机版

SLUSDE1E September 2018 – November 2024 UCC21540 , UCC21540A , UCC21541 , UCC21542

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		UCC2154x	UNIT
THERMAL METRIC⁽¹⁾		DWK (SOIC)	UNIT
R_θJA	Junction-to-ambient thermal resistance	74.1	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	34.1	°C/W
R_θJB	Junction-to-board thermal resistance	32.8	°C/W
ψ_JT	Junction-to-top characterization parameter	23.7	°C/W
ψ_JB	Junction-to-board characterization parameter	32.1	°C/W

THERMAL METRIC⁽¹⁾		UCC2154x	UNIT
THERMAL METRIC⁽¹⁾		DW (SOIC)	UNIT
R_θJA	Junction-to-ambient thermal resistance	69.8	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	33.1	°C/W
R_θJB	Junction-to-board thermal resistance	36.9	°C/W
ψ_JT	Junction-to-top characterization parameter	22.2	°C/W
ψ_JB	Junction-to-board characterization parameter	36	°C/W

(1) For more information about traditional and new thermal metrics, see the , Semiconductor and IC Package Thermal Metrics Application Report (SPRA953).