ZHCSNS8A april   2022  – june 2023 UCC21717-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety Limiting Values
    8. 6.8  Electrical Characteristics
    9. 6.9  Switching Characteristics
    10. 6.10 Insulation Characteristics Curves
    11. 6.11 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Propagation Delay
      1. 7.1.1 Non-Inverting and Inverting Propagation Delay
    2. 7.2 Input Deglitch Filter
    3. 7.3 Active Miller Clamp
      1. 7.3.1 Internal Active Miller Clamp
    4. 7.4 Undervoltage Lockout (UVLO)
      1. 7.4.1 VCC UVLO
      2. 7.4.2 VDD UVLO
    5. 7.5 Overcurrent (OC) Protection
      1. 7.5.1 OC Protection with Soft Turn-OFF
    6. 7.6 Soft Turn-Off Triggered by RST/EN
      1. 7.6.1 Soft Turn-Off Triggered by RST/EN
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Power Supply
      2. 8.3.2  Driver Stage
      3. 8.3.3  VCC and VDD Undervoltage Lockout (UVLO)
      4. 8.3.4  Active Pulldown
      5. 8.3.5  Short Circuit Clamping
      6. 8.3.6  Internal Active Miller Clamp
      7. 8.3.7  Overcurrent and Short Circuit Protection
      8. 8.3.8  Soft Turn-Off
      9. 8.3.9  Fault (FLT), Reset and Enable (RST/EN)
      10. 8.3.10 Isolated Analog to PWM Signal Function
    4. 8.4 Device Functional Modes
  10. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input Filters for IN+, IN-, and RST/EN
        2. 9.2.2.2 PWM Interlock of IN+ and IN-
        3. 9.2.2.3 FLT, RDY, and RST/EN Pin Circuitry
        4. 9.2.2.4 RST/EN Pin Control
        5. 9.2.2.5 Turn-On and Turn-Off Gate Resistors
        6. 9.2.2.6 Overcurrent and Short Circuit Protection
          1. 9.2.2.6.1 Protection Based on Power Modules with Integrated SenseFET
          2. 9.2.2.6.2 Protection Based on Desaturation Circuit
          3. 9.2.2.6.3 Protection Based on Shunt Resistor in Power Loop
        7. 9.2.2.7 Isolated Analog Signal Sensing
          1. 9.2.2.7.1 Isolated Temperature Sensing
          2. 9.2.2.7.2 Isolated DC Bus Voltage Sensing
        8. 9.2.2.8 Higher Output Current Using an External Current Buffer
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 静电放电警告
    7. 12.7 术语表
  14. 13Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

9.1 Application Information

The UCC21717-Q1 device is very versatile because of the strong drive strength, wide range of output power supply, high isolation ratings, high CMTI and superior protection and sensing features. The 1.5-kVRMS working voltage and 12.8-kVPK surge immunity can support both SiC MOSFET and IGBT modules with DC bus voltage up to 2121 V. The device can be used in both low power and high power applications such as the traction inverter in HEV/EV, on-board charger and charging pile, motor driver, solar inverter, industrial power supplies, and so forth. The device can drive the high power SiC MOSFET module, IGBT module, or paralleled discrete device directly without external buffer drive circuit based on NPN/PNP bipolar transistor in totem-pole structure, which allows the driver to have more control to the power semiconductor and saves the cost and space of the board design. The UCC21717-Q1 can also be used to drive very high power modules or paralleled modules with external buffer stage. The input side can support power supply and microcontroller signal from 3.3 V to 5 V, and the device level shifts the signal to output side through reinforced isolation barrier. The device has wide output power supply range from 13 V to 33 V and support wide range of negative power supply. This allows the driver to be used in SiC MOSFET applications, IGBT application and many others. The 12-V UVLO benefits the power semiconductor with lower conduction loss and improves the system efficiency. As a reinforced isolated single channel driver, the device can be used to drive either a low-side or high-side driver.

The UCC21717-Q1 device features extensive protection and monitoring features, which can monitor, report and protect the system from various fault conditions.

  • Fast detection and protection for the overcurrent and short circuit fault. The feature is preferable in a split source SiC MOSFET module or a split emitter IGBT module. For the modules with no integrated current mirror or paralleled discrete semiconductors, the traditional desaturation circuit can be modified to implement short circuit protection. The semiconductor is shutdown when the fault is detected and FLT pin is pulled down to indicate the fault detection. The device is latched unless a reset signal is received from the RST/EN pin.
  • Soft turn-off feature to protect the power semiconductor from catastrophic breakdown during overcurrent and short circuit fault. The shutdown energy can be controlled while the overshoot of the power semiconductor is limited.
  • UVLO detection to protect the semiconductor from excessive conduction loss. Once the device is detected to be in UVLO mode, the output is pulled down and the RDY pin indicates the power supply is lost. The device is back to normal operation mode once the power supply is out of the UVLO status. The power good status can be monitored from the RDY pin.
  • Analog signal sensing with isolated analog to PWM signal feature. This feature allows the device to sense the temperature of the semiconductor from the thermal diode or temperature sensing resistor, or dc bus voltage with resistor divider. A PWM signal is generated on the low voltage side with reinforced isolated from the high voltage side. The signal can be fed back to the microcontroller for the temperature monitoring, voltage monitoring, and so forth.
  • The active Miller clamp feature protects the power semiconductor from false turn on by driving an external MOSFET. This feature allows flexibility of the board layout design and the pulldown strength of the Miller clamp FET.
  • Enable and disable function through the RST/EN pin.
  • Short circuit clamping.
  • Active pulldown.
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