ZHCSTH3D December   2006  – July 2024 UCC27200 , UCC27201

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Stages
      2. 6.3.2 Undervoltage Lockout (UVLO)
      3. 6.3.3 Level Shift
      4. 6.3.4 Boot Diode
      5. 6.3.5 Output Stages
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input Threshold Type
        2. 7.2.2.2 VDD Bias Supply Voltage
        3. 7.2.2.3 Peak Source and Sink Currents
        4. 7.2.2.4 Propagation Delay
        5. 7.2.2.5 Power Dissipation
      3. 7.2.3 Application Curves
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 第三方米6体育平台手机版_好二三四免责声明
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 接收文档更新通知
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

4 Pin Configuration and Functions

UCC27200 UCC27201 D Package8-Pin SOICTop ViewFigure 4-1 D Package8-Pin SOICTop View
UCC27200 UCC27201 DDA Package8-Pin SO PowerPADTop ViewFigure 4-2 DDA Package8-Pin SO PowerPADTop View
UCC27200 UCC27201 DRM Package8-Pin VSONTop View Figure 4-3 DRM Package8-Pin VSONTop View
Table 4-1 Pin Functions
PIN I/O DESCRIPTION
NAME NO.
HB 2 I High-side bootstrap supply. The bootstrap diode is on-chip but the external bootstrap capacitor is required. Connect positive side of the bootstrap capacitor to this pin. Typical range of HB bypass capacitor is 0.022μF to 0.1μF, the value is dependant on the gate charge of the high-side MOSFET however.
HI 5 I High-side input.
HO 3 O High-side output. Connect to the gate of the high-side power MOSFET.
HS 4 I High-side source connection. Connect to source of high-side power MOSFET. Connect negative side of bootstrap capacitor to this pin.
LI 6 I Low-side input.
LO 8 O Low-side output. Connect to the gate of the low-side power MOSFET.
VDD 1 I Positive supply to the lower gate driver. Decouple this pin to VSS (GND). Typical decoupling capacitor range is 0.22μF to 1μF.
VSS 7 O Negative supply terminal for the device which is generally grounded.
PowerPAD PAD — Used on the DDA and DRM packages only. Electrically referenced to VSS (GND)(1). Connect to a large thermal mass trace or GND plane to dramatically improve thermal performance.
(1) The thermal pad is not directly connected to any leads of the package; however, it is electrically and thermally connected to the substrate which is the ground of the device.
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