ZHCSQI7B april   2023  – august 2023 UCC27301A-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 说明（续）
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Stages and Cross-Conduction Protection
      2. 8.3.2 Enable
      3. 8.3.3 Undervoltage Lockout (UVLO)
      4. 8.3.4 Level Shifter
      5. 8.3.5 Boot Diode
      6. 8.3.6 Output Stages
      7. 8.3.7 Negative Voltage Transients
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input Threshold Type
        2. 9.2.2.2 VDD Bias Supply Voltage
        3. 9.2.2.3 Peak Source and Sink Currents
        4. 9.2.2.4 Propagation Delay
        5. 9.2.2.5 Power Dissipation
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 接收文档更新通知
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 静电放电警告
    7. 12.7 术语表
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Package Option Addendum
      1.      54
    2. 13.2 Tape and Reel Information
    3. 13.3 Mechanical Data

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DRC|10
  • DDA|8
散热焊盘机械数据 (封装 | 引脚)

7.4 Thermal Information

THERMAL METRIC(1) UCC27301A-Q1 UCC27301A-Q1 UNIT
DDA (PowerPad™ SOIC) DRC (VSON)
8 Pins 10 Pins
RθJA Junction-to-ambient thermal resistance 47.1 51.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 60.8 58.3 °C/W
RθJB Junction-to-board thermal resistance 21.3 24.6 °C/W
ψJT Junction-to-top characterization parameter 6.3 1.7 °C/W
ψJB Junction-to-board characterization parameter 21.3 24.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 6.2 9.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
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