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ZHCSTB0E February 2010 – November 2023 UCC27321-Q1 , UCC27322-Q1

PRODUCTION DATA

封装选项

机械数据 (封装 | 引脚)

D|8
- MSOI002K
DGN|8
- MPDS046G

散热焊盘机械数据 (封装 | 引脚)

DGN|8
- PPTD076F

订购信息

7.4 Thermal Information

THERMAL METRIC⁽¹⁾⁽²⁾⁽³⁾		UCC2732x-Q1	UCC27322-Q1	UNIT
		D (SOIC)	DGN (MSOP-PowerPAD)
		8 PINS	8 PINS
R_θJA	Junction-to-ambient thermal resistance	113	58.6	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	61.7	45.3	°C/W
R_θJB	Junction-to-board thermal resistance	53.2	34.3	°C/W
ψ_JT	Junction-to-top characterization parameter	16	1.7	°C/W
ψ_JB	Junction-to-board characterization parameter	52.7	34	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	—	11.9	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

(2) In general, the system designer must attempt to use larger traces on the PCB where possible to spread the heat away from the device more effectively. For information on the PowerPAD package, see PowerPad™ Thermally Enhanced Package and PowerPad™ Made Easy.

(3) The PowerPAD thermal pad is not directly connected to any leads of the package. However, it is electrically and thermally connected to the substrate, which is the ground of the device.