ZHCSTX9I September 2002 – November 2023 UCC27321 , UCC27322 , UCC37321 , UCC37322
PRODUCTION DATA
请参考 PDF 数据表获取器件具体的封装图。
| THERMAL METRIC(1) | UCC27322 | UCC27321 | UNIT | ||
|---|---|---|---|---|---|
| D (SOIC) | P (PDIP) | DGN (MSOP-PowerPAD) | |||
| 8 PINS | 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 56.6 | 55.9 | 56.7 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 52.8 | 45.3 | 52.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 32.6 | 32.6 | 32.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1.8 | 23.0 | 1.8 | °C/W |
| ψJB | Junction-to-board characterization parameter | 32.3 | 32.5 | 32.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 5.9 | — | 5.9 | °C/W |