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ZHCSIU2K June 2001 – November 2023 UCC27323 , UCC27324 , UCC27325 , UCC37323 , UCC37324 , UCC37325

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		UCCx732x			UNIT
		D (SOIC)	DGN (MSOP With PowerPAD)	P (PDIP)
		8 PINS	8 PINS	8 PINS
R_θJA	Junction-to-ambient thermal resistance	107.3	56.6	55.5	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	52.2	52.8	45.3	°C/W
R_θJB	Junction-to-board thermal resistance	47.3	32.6	32.6	°C/W
ψ_JT	Junction-to-top characterization parameter	10.2	1.8	23	°C/W
ψ_JB	Junction-to-board characterization parameter	46.8	32.3	32.5	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	5.9	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.