ZHCSN70F November 2002 – November 2023 UCC27423 , UCC27424 , UCC27425
PRODUCTION DATA
请参考 PDF 数据表获取器件具体的封装图。
| THERMAL METRIC(1) | UCC2742x | UNIT | |||
|---|---|---|---|---|---|
| D (SOIC) | DGN (MSOP) | P (PDIP) | |||
| 8 PINS | 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 107.3 | 56.6 | 55.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 52.2 | 52.8 | 45.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 47.3 | 32.6 | 32.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 10.2 | 1.8 | 23.0 | °C/W |
| ψJB | Junction-to-board characterization parameter | 46.8 | 32.3 | 32.5 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | – | 5.9 | – | °C/W |