The useful range of a driver is greatly affected by the drive-power requirements of the load and the thermal characteristics of the package. In order for a gate driver to be useful over a particular temperature range the package must allow for the efficient removal of the heat produced while keeping the junction temperature within rated limits. The thermal metrics for the driver package is listed in the Section 5.4 table. For detailed information regarding the Section 5.4 table, refer to the Application Note from Texas Instruments entitled IC Package Thermal Metrics.

The UCC27511A-Q1 device is offered in a SOT-23, 6-pin package (DBV). Section 5.4 lists the thermal performance metrics related to SOT-23 package. The ψ_JT and ψ_JB metrics are used when estimating the die temperature during actual application measurements.

Heat removal occurs primarily through the leads of the device and the PCB traces connected to the leads.