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SLUSAQ3H November 2011 – June 2024 UCC27523 , UCC27525 , UCC27526

PRODUCTION DATA

封装选项

机械数据 (封装 | 引脚)

D|8
- MSOI002K
DSD|8
- MPDS238B
DGN|8
- MPDS046G

散热焊盘机械数据 (封装 | 引脚)

DSD|8
- QFND350C
DGN|8
- PPTD362A

订购信息

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) ⁽¹⁾⁽²⁾

		MIN	MAX	UNIT
Supply voltage	VDD	–0.3	20	V
OUTA, OUTB voltage	DC	–0.3	VDD + 0.3
OUTA, OUTB voltage	Repetitive pulse < 200 ns⁽⁴⁾	–2	VDD + 0.3
Output continuous source/sink current	I_{OUT_DC}		0.3	A
Output pulsed source/sink current (0.5 µs)	I_{OUT_pulsed}		5	A
INA, INB, INA+, INA–, INB+, INB–, ENA, ENB voltage⁽³⁾		–0.3	20	V
Operating virtual junction temperature, T_J		–40	150	°C
Lead temperature	Soldering, 10 s		300
Lead temperature	Reflow		260
Storage temperature, T_stg		–65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Section 6.3 is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltages are with respect to GND unless otherwise noted. Currents are positive into, negative out of the specified terminal. See Section 13 for thermal limitations and considerations of packages.

(3) The maximum voltage on the Input and Enable pins is not restricted by the voltage on the V_DD pin.

(4) Values are verified by characterization on bench.