ZHCSDP3A December   2014  – May 2015 UCC27528-Q1

PRODUCTION DATA.  

  1. 特性
  2. 应用范围
  3. 说明
  4. 修订历史记录
  5. 说明(续)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 VDD and Undervoltage Lockout
      2. 8.3.2 Operating Supply Current
      3. 8.3.3 Input Stage
      4. 8.3.4 Enable Function
      5. 8.3.5 Output Stage
      6. 8.3.6 Low Propagation Delays and Tightly Matched Outputs
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input-to-Output Logic
        2. 9.2.2.2 Enable and Disable Function
        3. 9.2.2.3 VDD Bias Supply Voltage
        4. 9.2.2.4 Propagation Delay
        5. 9.2.2.5 Drive Current and Power Dissipation
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12器件和文档支持
    1. 12.1 商标
    2. 12.2 静电放电警告
    3. 12.3 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 器件和文档支持

12.1 商标

All trademarks are the property of their respective owners.

12.2 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损伤。

12.3 术语表

SLYZ022TI 术语表

这份术语表列出并解释术语、首字母缩略词和定义。